The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 31, 2001

Filed:

Oct. 12, 1999
Applicant:
Inventors:

James E. Currie, Dover Plains, NY (US);

Michael Jones, Sunnyvale, CA (US);

Thomas J. Grebinski, Boise, ID (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/1302 ; C09K 1/300 ;
U.S. Cl.
CPC ...
H01L 2/1302 ; C09K 1/300 ;
Abstract

A planarization composition is set forth in accordance with an embodiment of the invention. The composition comprises spherical silica particles having a weight average particle diameter which falls within the range from about 0.03&mgr; to about 2&mgr; and is monodisperse in that at least about 90 weight percent of the particles have a variation in particle diameter from the average particle diameter of no more than about ±20%. A liquid carrier comprising up to 20 weight percent ROH, and an amine hydroxide which is NR,OH or NR,NR,OH, where each R is HCH,, CH,CH,, C,H,or C,H,, in the amount of 0.1 to 10 weight percent; an oxidizer which is in the amount from about 0.5% to 15% weight percent; an acid stabilizer for adjusting the pH to fall within a range from about 7.0 to about 0.5; and the remainder is water. The invention also relates to a thinning, polishing and planarizing apparatus and to a method for carrying out the thinning, polishing and planarizing operation.


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