The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 24, 2001
Filed:
Jul. 09, 1999
Applicant:
Inventor:
Kung Linliu, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F26B 5/08 ;
U.S. Cl.
CPC ...
F26B 5/08 ;
Abstract
A device and method for planarizing a film layer device on a silicon wafer. The device has a circular track whose surface faces the track center, a carrier capable of moving along the track and carrying wafers around with their front surfaces facing the center, and a set of heating elements for heating the film layers on the wafers to make them fluid. Utilizing the centrifugal force on the film layer generated by the circular movement and the fluidity of the film layer provided by heating, planarization of the film layer is achieved.