The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2001
Filed:
Jan. 28, 2000
Masatoshi Akagawa, Nagano, JP;
Daisuke Ito, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
Thickness of an IC card is decreased, and the manufacturing efficiency of the IC card is enhanced so as to reduce the manufacturing cost. The IC card comprises: a semiconductor element,having electrodes; a plane coil,formed in such a manner that a conductor,b is wound on the same face, having terminals,a at respective ends; bonding wires,for electrically connecting terminals at both ends of the plane coil to the electrodes of the semiconductor element; and resin films,for sealing the semiconductor element, plane coil and bonding wires,when they are interposed between the resin films, wherein the thickness of the semiconductor element,is smaller than the thickness of the plane coil,and does not interfere with the conductor of the plane coil, and a thin wall thickness portion,c is formed on a front face of the conductor of the plane coil through which the bonding wires can pass without protruding from the region of the thickness of the plane coil.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile