The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2001
Filed:
Oct. 12, 1999
Motoo Asai, Ibi-gun, JP;
Yoshitaka Ono, Ibi-gun, JP;
Masato Kawade, Ibi-gun, JP;
Kouta Noda, Ibi-gun, JP;
Youko Nishiwaki, Ibi-gun, JP;
Ibiden Co., Ltd., Gifu, JP;
Abstract
Adhesive adhesive for electroless plating ensures insulation reliabilities between lines and between layers while maintaining a practical peel strength, and a printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 2 &mgr;m, and comprised of rough particles and fine particles.