The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2001
Filed:
Oct. 20, 1999
Applicant:
Inventors:
Hui-Ling Wang, Hsin-Chu, TW;
Tong-Hua Kuan, Hsin-Chu, TW;
Ying-Lang Wang, Taichung, TW;
Yu-Ku Lin, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 1/00 ;
U.S. Cl.
CPC ...
B24B 1/00 ;
Abstract
A method to prevent the accumulation of particle impurities on the surface of a semiconductor substrate that contains wolfram plugs during the process of polishing the surface of the wafer. The polishing sequence consists of three distinct polishing steps whereby the first two steps use hard polishing pads while the third step uses a soft polishing pad with the application of slurry during the third polish.
Wang, Hui-Ling. (2001). Obtaining the better defect performance of the fuse cmp process by adding slurry polish on more soft pad after slurry polish (U.S. Patent No. 6248002). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6248002
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile