The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2001
Filed:
Jan. 25, 2000
Chien-Ping Huang, Hsinchu Hsien, TW;
Eric Ko, Taichung Hsien, TW;
Siliconware Precision Industries Co., Ltd., Taichung Hsien, TW;
Abstract
An universal lead frame type of Quad Flat Non-Lead package of semiconductor comprises a chip, a plurality of leads, a heat sink, and a molding compound. The leads are disposed at the periphery of the chip. The chip has its back surface bonded to the top surface of the heat sink, and the periphery of the top surface of the heat sink has a plurality of projections. The bonding portion at the periphery on the bottom surface of the heat sink is bonded to the top surface of the leads. The protruded portion at the center of the bottom surface of the heat sink is disposed in the opening region such that the bottom surface of the heat sink and the bottom surface of the leads are coplaner. The bonding pads of the chip are electrically connected to the top surface of the leads by a plurality of bonding wires. The molding compound encapsulates the chip, the heat sink, the top surface of the leads, and the bonding wires while exposes the protruded portion of the heat sink.