The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2001
Filed:
Mar. 13, 2000
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
The present invention provides wafer polishing apparatus in which the wafer holding head comprises a diaphragm substantially vertically expanded to the head axis in the head body; a carrier, which is fixed to the diaphragm and provided so as to be able to displace along the head axis direction together with the diaphragm; a retainer fixed to the diaphragm in a concentric relation to the carrier; a pressure adjusting mechanism for controlling the pressure of a fluid chamber formed between the diaphragm and the head body; a plurality of carrier torque mechanisms provided between the head body and the carrier for communicating the torque of the head body to the carrier; a plurality of first sensors, which is provided at individual torque transfer mechanism, for observing the force along the direction of rotation acting on the wafer; and a processor, which is connected to each first sensor, for calculating the force acting on the wafer based on the output from these first sensors.