The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2001
Filed:
Dec. 22, 1999
Jeng Yuan Lai, Taichung, TW;
Chien Ping Huang, Hsintsu Hsien, TW;
Siliconware Precision Industries, Co., Ltd., Taichung, TW;
Abstract
A heat-dissipating structure is designed for use on an integrated circuit (IC) package, such as a BGA (Ball Grid Array) integrated circuit package, for heat dissipation from the integrated circuit package during operation. The heat-dissipating structure includes a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as the integrated circuit chip enclosed in the integrated circuit package, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip. The heat-dissipating structure allows the integrated circuit chip to be prevented from being damaged by the thermal compressive stress from the encapsulant and the tensile stress from the silver paste for adhering the integrated circuit chip to a substrate on which the integrated circuit chip is mounted, thus allowing the integrated circuit package to be made more reliable with good yield rate.