The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2001
Filed:
Feb. 08, 1999
Yi-Chun Chang, Chung-Li, TW;
Jain-Hon Chen, Cha-yi, TW;
United Microelectronics Corp., Hsin-Chu, TW;
Abstract
The present invention provides a method for preventing corrosion of a bonding pad resulting from residual polymers on a surface of a semiconductor wafer. The bonding pad is a metallic layer formed on the surface of the semiconductor wafer. The semiconductor wafer comprises an inorganic passivation layer positioned above the bonding pad, and an organic dielectric layer positioned above the inorganic passivation layer. The passivation and dielectric layers comprise a hole etched to the bonding pad. The method uses an organic solution to clean off residual polymers on the surface of the bonding pad inside the hole to prevent corrosion of the bonding pad.