The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2001
Filed:
Aug. 26, 1999
Siliconware Precision Industries Co., Ltd., Taichung Hsien, TW;
Abstract
A tiny ball grid array package based on a substrate. The substrate has at least an insulation layer and two copper foils laminated together. A hole is formed near the center of the substrate. A second one of the copper foils is patterned into multiple conductive traces formed on a surface of the substrate, while a first one of the copper foils has a surface partly exposed. The first copper foil is coupled with the conductive traces by vias, meanwhile, the first copper foil is grounded to form a ground plane, so as to improve the electrically properties and the heat dissipation efficiency. Bonding pads are formed in one surface of a chip. This surface is thermal-conductively connected to the grounded level, and the bonding pads are located in the hole. The bonding pads are electrically connected to a near end of a conductive trace by a conductive wire, and solder balls are attached at a far end of the conductive trace. A molding material fills the hole and covers a surrounding area of the hole to protect the bonding pads, the conductive wire, and the conductive traces, so as to cover ajunction area of the chip and the ground plane.