Dispersion containing cu ultrafine particles individually dispersed therein

Abstract

A dispersion containing Cu ultrafine particles individually dispersed therein comprises an organic solvent which is hardly evaporated at room temperature, but can be evaporated during a drying-firing step upon forming Cu-distributing wires on a semiconductor substrate and metal Cu-containing ultrafine particles having a particle size of not greater than 0.01 &mgr;m, in which the surface of the individual Cu ultrafine particles is surrounded by or covered with the organic solvent, these particles are independently dispersed in the solvent, and the dispersion has a viscosity of not higher than 50 cP at 20° C. The individual Cu ultrafine particle dispersion permits the complete embedding or filling of, for instance, fine wiring grooves, via holes and contact holes of LSI substrates with a Cu-thin film and thus permits the formation of a conductive, uniform and fine pattern on a substrate.