The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2001
Filed:
Sep. 18, 1998
Ryuji Kohno, Ibaraki-ken, JP;
Tetsuo Kumazawa, Ibaraki-ken, JP;
Makoto Kitano, Tsuchiura, JP;
Akihiko Ariga, Musashimurayama, JP;
Yuji Wada, Tachikawa, JP;
Naoto Ban, Sagamihara, JP;
Shuji Shibuya, Sayama, JP;
Yasuhiro Motoyama, Kodaira, JP;
Kunio Matsumoto, Yokohama, JP;
Susumu Kasukabe, Yokohama, JP;
Terutaka Mori, Urayasu, JP;
Hidetaka Shigi, Kanagawa-ken, JP;
Takayoshi Watanabe, Kanagawa-ken, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
Dispersion of a load may be kept within a predetermined allowance even when a plurality of probes in a large area are pressed in batch by pressing the probes provided in a membrane against a wafer by applying a pressure load to a plurality of places on a plane of the pressure members on the side opposite the wafer in a probe test step, burn-in test step which represent typical semiconductor device manufacturing steps. It is then possible to provide semiconductor devices and a manufacturing method thereof which enhance the reliability and productivity of the semiconductor devices by probing a large number of integrated circuits or a large size integrated circuit at the same time.