Wafer transfer device and method

Abstract

A substrate handling apparatus includes a transfer elevator and a process station disposed inside a load lock chamber. The process station includes a top module, a bottom module, and a seal ring which is disposed between the top module and the bottom module and is movable to open and close the process station. The transfer elevator has an upper station spaced above a lower station. A transfer device having a pair of transfer arms is used to transfer substrates between the transfer elevator and the process station. The transfer arms are movable toward one another to support a substrate and apart from one another to release the substrate. The transfer arms are mounted to rotate between the transfer elevator and the process station. When a substrate is being processed inside the process station, the transfer arms are disposed on opposite sides of the process station. Upon completion of processing the substrate, the seal ring is opened, and the transfer arms move between the top module and seal ring to grasp the processed substrate and transfer it to the lower station of the transfer elevator (or upper station as desired) by simple rotation. The transfer arms are moved apart to release the processed substrate onto the lower station. The transfer elevator is lowered to align a fresh substrate disposed on the upper station with the transfer arms, which are moved toward one another to grasp the fresh substrate and transfer it to the process station by rotation. The transfer arms are then moved apart to release the fresh substrate into the process station. The seal ring of the process station is closed to seal the top and bottom modules together for processing the fresh substrate disposed therein.