Apparatus for sensing temperature on a substrate in an integrated circuit fabrication tool

Abstract

A cable and interconnect design including a substrate containing discrete sensors in a plurality of cavities or a plurality of thin film sensors deposited throughout the substrate surface. The discrete sensors are bonded within each cavity and potted with a potting compound. Each sensor has leads joined to filaments by an interconnect system. Thin film sensor leads on the substrate connect to a signal transmitting cable by the interconnect system. The filaments are coated and converge at a strain relief coupled to the substrate. The cable, having flat and round portions, includes an array of flat signal transmitting cables arranged side by side in the flat portion and stacked one on top of the other in the round portion. Each signal cable contains a plurality of the filaments bonded together. A pair of ribbons extend along the length of the array of cables. The ribbons and array of cables are bonded together with film to form the flat portion. The ribbons are joined to the strain relief, thereby joining the cable to the substrate. A boot is disposed around the cable transition between the flat and round portions. A connector is coupled to the round portion and the filaments are terminated to the connector. Advantages include the interconnect system bonding pads which reduce fabrication time and provide simple connection geometry on the substrate. Integration of the ribbons into the flat portion allows repeated use in a vacuum seal without damaging the cables. Stacked flat cables make identification of the filaments easy and product assembly fast.