The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2001

Filed:

Nov. 12, 1999
Applicant:
Inventors:

Seiji Ichikawa, Tokyo, JP;

Takeshi Umemoto, Tokyo, JP;

Toshiaki Nishibe, Tokyo, JP;

Kazunari Sato, Tokyo, JP;

Kunihiko Tsubota, Tokyo, JP;

Masato Suga, Tokyo, JP;

Yoshikazu Nishimura, Tokyo, JP;

Keita Okahira, Tokyo, JP;

Tatsuya Miya, Tokyo, JP;

Toru Kitakoga, Tokyo, JP;

Kazuhiro Tahara, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract

A semiconductor device is disclosed wherein a pair of radiating terminals and a plurality of lead terminals are formed from a single lead frame. A hole or holes in each radiating terminal are formed with an equal width and in an equal pitch to those of gaps between the lead terminals, and the opposite sides of each hole of the radiating terminal are connected to each other by a support element. The support elements of the radiating terminals and support elements which interconnect the lead terminals are formed with an equal length and in an equal pitch to allow the support elements to be cut away by a plurality of punches which are arranged in an equal pitch and have an equal width.


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