The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2001
Filed:
Oct. 15, 1999
Applicant:
Inventors:
Yu-Fang Tsai, Kaohsiung, TW;
Su Tao, Kaohsiung, TW;
Simon Lee, Tainan, TW;
Tao Yu Chen, Kaohsiung, TW;
Assignee:
Advanced Semiconductor Engineering Inc., Kaohsiung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/100 ; B23K 3/102 ; H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
B23K 3/100 ; B23K 3/102 ; H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract
A ball bonding method on a chip mainly comprises steps of: a wire is burned to form a ball on a capillary; the capillary is moved down to a second bonding point for ball bonding; and the capillary is moved up in a vertical direction thereby pulling the tip of the ball to be cut such that the ball has a uniformly body shape and tip height. Therefore, the ball provides uniform body shape and tip height for wire bonding at a second bonding point under lower variability conditions thus increasing the reliability of products.