The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2000

Filed:

Jul. 28, 1998
Applicant:
Inventors:

Seiji Ichikawa, Tokyo, JP;

Takeshi Umemoto, Tokyo, JP;

Kazunari Sato, Tokyo, JP;

Kunihiko Tsubota, Tokyo, JP;

Yoshikazu Nishimura, Tokyo, JP;

Toshiaki Nishibe, Tokyo, JP;

Kazuhiro Tahara, Tokyo, JP;

Masato Suga, Tokyo, JP;

Toru Kitakoga, Tokyo, JP;

Tatsuya Miya, Tokyo, JP;

Keita Okahira, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257706 ; 257675 ; 257692 ; 257693 ; 257684 ; 257699 ; 257666 ; 257797 ; 257796 ; 257712 ; 257676 ; 174 522 ; 361820 ; 361723 ;
Abstract

A semiconductor device of the present invention comprises a semiconductor pellet, a radiation plate mounted with the semiconductor pellet, a plurality of lead terminals electrically connected with the semiconductor pellet, and a resin member for encapsulating the above items. The resin member has a first surface and a second surface, and the radiation plate has a first portion exposed to the outside from the first surface of the resin member and a second portion exposed to the outside from the second surface of the resin member.


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