The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2000

Filed:

Mar. 05, 1999
Applicant:
Inventors:

Yuji Kamikawa, Kikuchi-gun, JP;

Satoshi Nakashima, Tamana-gun, JP;

Assignee:

Tokyo Electron Limited, Tokyo-To, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F26B / ;
U.S. Cl.
CPC ...
34401 ; 34179 ; 34164 ;
Abstract

In order to remove water adhering to the surfaces of cleaned semiconductor wafers W, a vibration transmitting device 20 capable of approaching the surfaces of the semiconductor wafers W, and an oscillator 25 for applying an ultrasonic vibration to the vibration transmitting device 20. The oscillator 25 is driven to apply the ultrasonic vibration to the vibration transmitting plates 24 of the vibration transmitting device 20 and to apply energy of the ultrasonic vibration to a gas between the vibration transmitting device 20 and the surfaces of the semiconductor wafer W to remove water adhering the surfaces of the semiconductor wafers W. Thus, it is possible to surely remove water adhering to the surfaces of cleaned objects to be treated, to dry the objects without the need of a dry gas of an organic solvent vapor, such as IPA.


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