The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2000

Filed:

Mar. 09, 1998
Applicant:
Inventors:

Sheldon Aronowitz, San Jose, CA (US);

David Chan, San Jose, CA (US);

James Kimball, San Jose, CA (US);

David Lee, San Jose, CA (US);

John Haywood, Santa Clara, CA (US);

Valeriy Sukharev, Cupertino, CA (US);

Assignee:

LSI Logic Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438287 ; 257324 ; 257411 ; 438591 ; 438775 ; 438786 ;
Abstract

Provided are methods for fabricating hardened composite thin layer gate dielectrics. According to preferred embodiments of the present invention, composite gate dielectrics may be produced as bilayers having oyxnitride portions with nitrogen contents above 10 atomic percent, while avoiding the drawbacks of prior art nitridization methods. In one aspect of the present invention, a hardened composite thin layer gate dielectric may be formed by deposition of a very thin silicon layer on a very thin oxide layer on a silicon substrate, followed by low energy plasma nitridization and subsequent oxidation of the thin silicon layer. In another aspect of the invention, low energy plasma nitridization of a thin oxide layer formed on a silicon substrate may be followed by deposition of a very thin silicon layer and subsequent oxidation, or additional low energy plasma nitridization and then oxidation, of the thin silicon layer.


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