The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2000
Filed:
Feb. 04, 1998
H Bernhard Pogge, Hopewell Junction, NY (US);
Bijan Davari, Mahopac, NY (US);
Johann Greschner, Pliezhausen, DE;
Howard L Kalter, Colchester, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for fabricating an integrated circuit package or arrangement includes providing a carrier having a surface topography of projections or recesses for supporting individual semiconductor circuit chips having conversely matching bottom surface topographies to permit self-aligned positioning of the chip on the carrier. Chips are provided such that top faces of neighboring chips lie substantially in planes separated by a distance of greater than 0.0 .mu.m. The carrier is arranged and dimensioned such that the neighboring chips are separated by a gap G or spacing in a range of 1 .mu.m<G.ltoreq.100 .mu.m. A metallic interconnect is provided over the top faces and the gap. Preferably, the interconnect has a gradual slope over the gap.