The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2000
Filed:
Jun. 17, 1996
Du B Nguyen, Fairfield County, CT (US);
Hazara S Rathore, Dutchess County, NY (US);
George S Prokop, Dutchess County, NY (US);
Richard A Wachnik, Putnam County, NY (US);
Craig R Gruszecki, Dutchess County, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of fabricating on chip metal-to-metal capacitors (MMCAP) uses planar processing with a flexible choice of dielectric, thickness and capacitor shape. The method provides a simpler process which has a better yield and more reliable structure by creating a metal-to-metal capacitor on a planar surface, not in deep trenches. In addition to the process simplicity, the method also allows the use of any dielectric materials which are needed by the product designer; e.g., higher or lower dielectric constant and also not limited by high etch rate difference. Because the inventive process is a planar process, there are no corners in the bottom of deep trenches to cause yield and reliability problems. The capacitor area can be adjusted to any shape because there are no edge effects.