The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2000
Filed:
Mar. 06, 1998
Tetsuya Sada, Kumamoto-ken, JP;
Norio Uchihira, Kumamoto-ken, JP;
Mitsuhiro Sakai, Kumamoto-ken, JP;
Kiyomitsu Yamaguchi, Kumamoto-ken, JP;
Tokyo Electron Limited, , JP;
Abstract
A treatment device comprising a holding method for holding a substrate such as an LCD substrate; and a treatment solution supply method for supplying a treatment solution on a surface of the substrate wherein the holding method has a substrate-placing portion on which the substrate is disposed, the substrate-placing is made of a synthetic resinous material. Since the holding method has a substrate-placing portion which is made of a synthetic resinous material, the electric charge amount of the substrate can be reduced to prevent various static electricity caused troubles such as the electrostatic destruction of the device formed on the substrate. Further, a discharge noise trouble due to discharge phenomenon from the substrate to a transporting method can be prevented. Further, it is possible to reduce the electric charge amount of the holding method and destaticize the holding method by supplying a destaticizing fluid such as ionized pure water or ionized gas towards above or below the holding method. Thus, it is possible to prevent various static-electricity caused troubles such as the electrostatic destruction of the device formed in the device from occurring and further, possible to prevent noise troubles from occurring because the generation degree of the discharge which occurs between the substrate and the transport method can be reduced further. The electric charge amount of the substrate can be reduced by making the thickness (distance) of the substrate-placing portion formed of a dielectric thick (long).