The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2000

Filed:

Feb. 19, 1997
Applicant:
Inventors:

Haruki Nojo, Kanagawa-ken, JP;

Rempei Nakata, Kamakura, JP;

Kiyotaka Kawashima, Yokohama, JP;

Assignees:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F / ; B24B / ;
U.S. Cl.
CPC ...
156345 ; 451 60 ; 451287 ; 451446 ; 438692 ; 438693 ;
Abstract

The first pipe 34 delivers the first solution 21 containing polishing particles. The second pipe 37, containing a liquid mass flow unit 36, delivers the second solution containing a chemical substance. The outlet port of the first pipe and the outlet port of the second pipe are connected to one end portion of the third pipe 31. The third pipe has the other end portion with an inner diameter almost equal to the inner diameter of its one end portion. The first and second solutions introduced into the third pipe are mixed in the third pipe to generate a polishing liquid. The generated polishing liquid is supplied from the other end portion of the third pipe onto a polishing pad 13 to polish a semiconductor wafer 16.


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