The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2000

Filed:

Jan. 14, 1998
Applicant:
Inventors:

Hiroshi Tomita, Yokohama, JP;

Hisashi Muraoka, Yokohama, JP;

Ryuji Takeda, Shibata, JP;

Assignees:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Purex Co., Ltd., Yokohama, JP;

Toshiba Ceramics Co., Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438476 ; 438471 ;
Abstract

A method of removing metallic impurities diffused in a semiconductor substrate, comprising, the semiconductor-substrate-heating step of heating a semiconductor substrate to at least 200.degree. C. or higher and promoting the release and rediffusion of metallic impurities diffused in the semiconductor substrate, and the metallic-impurity-removing step of dissolving the metallic impurities arrived at the surface of the semiconductor substrate with a chemical agent and removing them from the substrate.


Find Patent Forward Citations

Tomita, Hiroshi. (2000). Method of and apparatus for removing metallic impurities diffused in a (U.S. Patent No. 6054373). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6054373

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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