The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 28, 2000

Filed:

Aug. 03, 1999
Applicant:
Inventors:

Chi-Fung Lo, Fort Lee, NJ (US);

Darryl Draper, Congers, NY (US);

Hung-Lee Hoo, Livingston, NJ (US);

Paul S Gilman, Suffern, NY (US);

Assignees:

Sony Corporation, Tokyo, JP;

Materials Research Corporation, Orangeburg, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F / ; B22F / ;
U.S. Cl.
CPC ...
419-8 ; 419 48 ; 419 54 ;
Abstract

There is provided a method for fabricating intermetallic sputter targets of two or more elements in which a mixture of two or more elemental powders are blended and synthesized within a pressing apparatus at a temperature below the melting point of the lowest melting point element in the mixture, followed by heating the synthesized intermetallic powder in the pressing apparatus to a temperature below the melting point of the intermetallic structure while simultaneously applying pressure to the powder to achieve a final density greater than 90% of theoretical density. The powder metallurgy technique of the present invention provides a better microstructure than cast structures, and avoids contamination of the sputter target by eliminating the crushing step of synthesized intermetallic chunks necessitated by separate steps of synthesizing and pressing.


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