The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2000
Filed:
Feb. 03, 1997
Applicant:
Inventor:
Chue-San Yoo, Hsin-chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438697 ; 438626 ; 438633 ; 438645 ; 438723 ; 438704 ; 438734 ; 438750 ; 216 57 ; 216 89 ; 216 99 ;
Abstract
An improved and new method for forming a planarized integrated cirsuit structure has been developed. The method uses a combination of etchback and chemical/mechanical polishing (CMP), in which the etchback process uses a tailored mask to compensate for non-unifomity of material removal by the subsequent chemical/mechanical (CMP) process, thereby resulting in improved planarization and superior thickness uniformity.
Yoo, Chue-San. (2000). Planarization process using tailored etchback and cmp (U.S. Patent No. 6025270). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6025270
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile