The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 1999

Filed:

Mar. 19, 1997
Applicant:
Inventors:

Qi-Zhong Hong, Dallas, TX (US);

Shin-Puu Jeng, Plano, TX (US);

Wei-Yung Hsu, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438629 ;
Abstract

A method is provided for forming sidewall diffusion barriers from a dielectric material. A trench or via is formed in a semiconductor device. A layer of dielectric material is deposited over the surfaces of the semiconductor device. The deposited layer of dielectric material is removed from all surfaces except the sidewall of the trench or via, thereby forming the dielectric diffusion barriers on the sidewall. Because dielectric materials have an amorphous structure which does not readily permit diffusion, impurities do not need to be added to the dielectric diffusion barriers. Furthermore, dielectric diffusion barriers produce a smaller RC time delay relative to metallic diffusion barriers having a comparable thickness.


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