The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 1999
Filed:
Jun. 16, 1998
Tzung-Han Lee, Taipei, TW;
Chi-Fa Ku, Hsinchu Hsien, TW;
Army Chung, Hsinchu, TW;
Chien-Li Kuo, Hsinchu Hsien, TW;
United Microelectronics Corp., Hsinchu, TW;
Abstract
The invention provides a method of avoiding peeling on the wafer edge and the mark number. The method uses a design rule to expose the multi-layer on a wafer. The limit and the scope of the exposed distance are taken to ensure the polysilicon layers and the metal layers are covered by the dielectric layer after exposure. The polysilicon layers or the metal layers don't unclothe from the overlarge distance at the exposed dielectric layer, so the next structure formed on the exposed dielectric layer doesn't peeling from contacting with the polysilicon layer or the metal layer. The invention avoids to contaminate the wafer and the machine after the particles forming from peeling.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile