The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 1999

Filed:

Jun. 28, 1996
Applicant:
Inventors:

Masahiro Ogasawara, Kofu, JP;

Ryo Nonaka, Yamanashi-ken, JP;

Yoshiyuki Kobayashi, Yamanashi-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; H05H / ; H01L / ;
U.S. Cl.
CPC ...
427535 ; 427534 ; 427569 ; 427570 ; 427573 ; 438711 ; 438729 ; 438798 ; 216 67 ; 216 71 ;
Abstract

A wafer is subjected to a plasma process, using plasma generated while a process gas is fed into a process room, and a plus DC voltage is applied to an electrostatic chuck in order to attract and hold the wafer on the electrostatic chuck by an electrostatic force. A minus DC voltage is applied to the electrostatic chuck while nitrogen gas is fed into the process room in order to cause DC discharge after the processed wafer is separated from the electrostatic chuck and before a next wafer is attracted and held on the electrostatic chuck. By doing so, plus electric charge in the gas is attracted to the electrostatic chuck, so that the surface of the electrostatic chuck is charged with plus electric charge, thereby preventing its attracting function from being deteriorated.


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