The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 1999
Filed:
Jul. 29, 1997
Akira Kawakawaguchi, Hyogo-ken, JP;
Shigeru Kimura, Hyogo-ken, JP;
Akihito Yanoo, Hyogo-ken, JP;
Masao Takada, Hyogo-ken, JP;
Shoji Tsuruta, Tokyo, JP;
Shigeo Kumabe, Tokyo, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Mitsubishi Materials Silicon Corporation, Tokyo, JP;
Abstract
A semiconductor wafer chamfer polishing method for polishing chamfers formed on the edges of semiconductor wafers includes rotating a semiconductor wafer; pressing a polishing cloth against a chamfer of the semiconductor wafer with sufficient pressure to elastically deform the polishing cloth, while supplying polishing fluid to the chamfer; sliding the polishing cloth along an incline of the chamfer from an outer edge toward a center of the semiconductor wafer so as to form a bulge portion of the polishing cloth which contacts an outer surface of the semiconductor wafer, thereby polishing the outer surface along with the chamfer of the semiconductor wafer.