The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 1999
Filed:
Jan. 22, 1998
Giulio DiGiacomo, Hopewell Junction, NY (US);
Stephen S Drofitz, Jr, Wappingers Falls, NY (US);
David L Edwards, Poughkeepsie, NY (US);
Larry D Gross, Los Gatos, CA (US);
Sushumna Iruvanti, Wappingers Falls, NY (US);
Raed A Sherif, Croton-on Hudson, NY (US);
Subhash L Shinde, Cortlandt Manor, NY (US);
David J Womac, Lagrangeville, NY (US);
David B Goland, Croton-on Hudson, NY (US);
Lester W Herron, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.