Substrate holder for a plasma processing system

Abstract

To eliminate variations in process characteristics by suppressing variations in the temperature of a characteristic correction ring as time passes, a substrate holder holds a substrate 10 while the desired process is performed on the substrate 10 with plasma P. The substrate holder is equipped with a holder main body 1 that holds the substrate 10 in planar contact with a substrate holding surface 20. A substrate temperature regulation mechanism 5 regulates the temperature of the substrate 10 by exchanging heat across the substrate holding surface 20, and a characteristic correction ring 9 surrounds the substrate 10 and corrects variations in process characteristics at the peripheral parts of the substrate 10, wherein the characteristic correction ring 9 is provided with a ring cooling mechanism that prevents the characteristic correction ring 9 from storing up heat from the plasma P and increasing in temperature as time passes. The substrate temperature regulation mechanism 5 also serves as a ring cooling means, being configured with the ability to cool the substrate 10 by causing a temperature medium to circulate inside the holder main body 1, and is provided with a contact improvement means, such as a static adhesion mechanism 6 which improves the thermal contact of the characteristic correction ring 9 against holder main body 1.