The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 21, 1999

Filed:

Aug. 11, 1997
Applicant:
Inventor:

Hirokatsu Niijima, Gyoda, JP;

Assignee:

Advantest Corp., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03K / ; H03H / ;
U.S. Cl.
CPC ...
327262 ; 327513 ; 327232 ;
Abstract

A temperature compensation circuit for an IC device delay circuit compensates fluctuations of delay time in the IC device caused by temperature changes. The temperature compensation circuit accurately compensates the temperature even when there exist deviations of electrical characteristics in the circuit components in the IC device delay circuit, such as heat dissipation by a heater. The temperature compensation circuit includes a heater to generate heat to raise temperature of the IC device delay circuit when the heater is on, a flip-flop for turning the heater off when an input signal is provided to an input terminal of the IC device delay circuit and turns the heater on when the input signal returns to the flip-flop after a selected delay time, a plurality of delay elements each having a predetermined delay time for producing delayed signals, and a selector circuit for selecting one of the delayed signals from the delay elements.


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