The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 1999
Filed:
Dec. 19, 1997
Applicant:
Inventors:
Kian Teng Eng, Singapore, SG;
Min Yu Chan, Singapore, SG;
Jing Sua Goh, Singapore, SG;
Siu Waf Low, Singapore, SG;
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
174 524 ; 257691 ; 257738 ; 257693 ;
Abstract
An integrated circuit package (30) including a substrate (70) having an opening (86) and first and second surfaces(92, 94), a plurality of pads (100) disposed on the first and second surfaces (92, 94) having disposed thereon solder balls (150) electrically connected by a via (84) that provides the end-user with flexibility in the location of a power supply Pin (96) is disclosed.