The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 1999

Filed:

May. 20, 1996
Applicant:
Inventors:

Chen-Wei Lee, Taipei, TW;

Kuan-Cheng Su, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438278 ; 438217 ;
Abstract

A semiconductor fabrication method that enhances the ESD (electrostatic discharge) protection capability of an ESD protective device provided in an integrated circuit such as a mask-programmed ROM, allows the mask-programmed ROM to be downsized while still providing adequate ESD protection capability, and allows the mask-programmed ROM to be fabricated in a smaller size, while nonetheless providing adequate ESD protection capability for the internal circuit. Initially, a mask for the ion implantation process for the ROM is prepared. The mask is patterned additionally with a plurality of strips used to define breakdown voltage controlling areas in the ESD protective device. Then, the ion implantation process is performed through the mask so as to form the breakdown voltage controlling areas each beneath the drain of the n-type CMOS transistor. The breakdown voltage controlling areas are heavily doped, thereby reducing the breakdown voltage at the junction between the drain and the p-well in the n-type CMOS transistor. This enhances the ESD protection capability of the integrated circuit.


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