Projection patterning of large substrates using limited-travel x-y stage

Abstract

A large-format substrate patterning system, for microelectronics manufacturing, utilizes a substrate docking fixture to enable relative motion between the substrate stage and the substrate. This enables exposure of a large-format substrate which has been partitioned into different modules where each module contains an entire pattern transferred from a mask. This projection system enables patterning of a large multi-module substrate using a stage whose range of travel is smaller than the size of the substrate and using a mask whose area is smaller than the size of the substrate. This is accomplished by repositioning the substrate to expose each module sequentially. In order to reposition the substrate, its location is maintained fixed in space by a substrate docking fixture while the movable stage of the lithography system is repositioned to position a different module of the substrate in the image field of the lithography tool. This allows the use of a mask whose size is determined by the size of each substrate module, and the use of a scanning stage whose required range of travel is determined by the size of the substrate module, and not by the size of the entire substrate. This eliminates the size limitation of the substrate from dependence on the range of travel of the stage, and permits the repetitive use of a small mask or series of small masks to produce a composite multi-module pattern on the substrate.