The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 1999
Filed:
Oct. 23, 1996
Masaki Ohkawara, Sayama, JP;
Nobuyuki Aoyagi, Fussa, JP;
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Abstract
In a method for detecting and picking up dies from a wafer, when a defective die is detected inside a predetermined reversing range defined on the wafer, the die detection and pick-up movement is shifted one pitch to the next row of dies so as to detect the first die of the next row. If the first die of the next row is not a defective die, the die detection and pick-up movement proceeds toward the edge of the wafer in the X direction and successively detects and picks up dies on that row. Then, when a defective die is detected on that row, the direction of the die detection and pick-up movement is reversed without picking up the defective die, so that the die located immediately at the inner side of the first die of that row is detected and picked up, and non-defective dies on that row are successively detected and picked up. If the first die on the next row described above is a defective die, then the die detection and pick-up movement proceeds in the reverse direction so that the dies on the that row are successively detected and picked up as long as they are not defective dies.