The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 1999
Filed:
Dec. 23, 1996
Applicant:
Inventor:
Wei-Kay Chiu, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd, Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B01J / ;
U.S. Cl.
CPC ...
427560 ; 427346 ; 427600 ;
Abstract
A method is disclosed to improve the planarization of a coating upon a substrate, in particular to improve the planarization of a photoresist or spin-on-glass coating upon a semiconductor wafer. This is achieved by coupling an ultrasonic wave generator to either the chuck or the spindle of the chuck. Ultrasonic waves emanating from the ultrasonic generator are induced into the coating, vibrating it. The vibration causes coating material to fill in the valleys of the coating, thus planarizing the surface of the coating.