The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 1999
Filed:
Feb. 22, 1994
Michael John Brady, Brewster, NY (US);
Curtis Edward Farrell, Brewster, NY (US);
Sung Kwon Kang, Chappaqua, NY (US);
Jeffrey Robert Marino, Clifton Park, NY (US);
Donald Joseph Mikalsen, Carmel, NY (US);
Paul Andrew Moskowitz, Yorktown Heights, NY (US);
Eugene John O'Sullivan, Upper Nyack, NY (US);
Terrence Robert O'Toole, Hopewell Junction, NY (US);
Sampath Purushothaman, Yorktown Heights, NY (US);
Sheldon Cole Rieley, Burlington, VT (US);
George Frederick Walker, New York, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.