The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 1998
Filed:
Apr. 26, 1996
Applicant:
Inventors:
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
29843 ; 29593 ; 324757 ;
Abstract
Bumps to be connected to inspection electrodes of semiconductor chips are formed on a surface of a flexible substrate. A plating layer is formed which is made of a harder material than the bumps formed on the flexible substrate and which has a concave portion or a convex portion whose diameter is equal to or smaller than half the diameter of the bumps, on a flat metallic plate. The plating layer of the metallic plate is pressed against top surfaces of the bumps, so that irregularities are formed in the top surfaces of the bumps.