The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 1998
Filed:
May. 31, 1995
Applicant:
Inventors:
Hisashi Masumura, Fukushima-ken, JP;
Kiyoshi Suzuki, Fukushima-ken, JP;
Hideo Kudo, Fukushima-ken, JP;
Assignee:
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F / ;
U.S. Cl.
CPC ...
156345 ; 216 88 ; 216 89 ; 438690 ; 438691 ; 438692 ; 438693 ;
Abstract
A polishing pad composed of a rigid polyurethane added with CaCO.sub.3 particles is able to provide polished wafers having a surface roughness which is comparable to that attained by the conventional final polishing process. Even when polishing is achieved under a high load condition to improve the productivity, the polished wafers are free from deformation, such as concaving, and have an excellent flatness.