Semiconductor device structure

Abstract

An ultra-thin resin molded semiconductor device of high reliability with low cost and with easy repair at time of mounting. A plurality of these semiconductor devices are stacked to provide a semiconductor module which has a higher function than semiconductor devices in the same volume, and a card type module utilizing assembled by the stacked semiconductor module is provided. In manufacturing the semiconductor module, an extremely thin lead frame and an LSI chip are directly connected together, and the mirror surface of the LSI chip is exposed by using a low viscosity epoxy resin to have a thin molding. The mirror surface is grinded to have a further thin thickness of the whole structure of the semiconductor device. A part of the lead frame is formed as a reinforcing member, a heat radiation path, a light shielding part for shielding the LSI from harmful light beams, or a positioning base for mounting a substrate. The above ultra-thin resin molded semiconductor devices are interconnected together in a stacked layout to provide a stacked semiconductor module, and to provide a card type device having a higher function.