The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 1998

Filed:

Oct. 20, 1997
Applicant:
Inventors:

Bo Yu, Singapore, SG;

Qing Hua Zhong, Singapore, SG;

Jian Hui Ye, Singapore, SG;

Mei Sheng Zhou, Singapore, SG;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438424 ; 438435 ; 438701 ; 438978 ; 148D / ; 148D / ;
Abstract

A method for forming insulator filled, shallow trench isolation regions, with rounded corners, has been developed. The process features the use of a polymer coated opening, in an insulator layer, used as a mask to define the shallow trench region in silicon. After completion of the shallow trench formation the polymer spacers are removed, exposing a region of unetched semiconductor, that had been protected by the polymer spacers, during the shallow trench dry etching procedure. The sharp corner, at the intersection between the shallow trench and the unetched region of semiconductor, is then converted to a rounded corner, via thermal oxidation of exposed silicon surfaces. The polymer spacers also eliminate the top corner wraparound.


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