The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 1998

Filed:

Feb. 09, 1996
Applicant:
Inventors:

Ming-Tzong Yang, Hsinchu, TW;

Hong-Tsz Pan, Hsinchu Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438622 ; 438624 ; 438631 ; 438926 ;
Abstract

A method of automatically generating dummy metals for multilevel interconnection makes use of a quantum array pattern accompanying an operating pattern to from a metal pattern. The method comprises the combination selected from intersection (AND), union (OR), oversizing, downsizing, or incorporation operation through computer-aided design (CAD). Therefore, the application of the metal pattern to a process for fabricating a multimetal structure can acquire full planarization between two metal layers because of the arrangement that several dummy metals are positioned among the metal lines to diminish the spacing which exceeds the planarization limit. Also, the dummy metals are shaped in blocks thereby preventing the loading effect during etching and decreasing the parasitic capacitance therebetween.


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