The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 1998
Filed:
Apr. 07, 1997
Sushumna Iruvanti, Wappingers Falls, NY (US);
Martin Klepeis, Poughkeepsie, NY (US);
Gaetano Paolo Messina, Hopewell Junction, NY (US);
Raed Sherif, Croton, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electronic module is provided comprising integrated circuit chips mounted on a substrate and having a specially designed cooling plate overlying the chip producing a gap above about 1 mil and a thermal paste or thermal adhesive between the cooling plate and the chip to facilitate heat transfer from the chip to the cooling plate. The cooling plate has a roughened area made by grit blasting and the like and having a roughness of about 0.4 to 6.4 microns or comprising a plurality of channels and corresponding protrusions overlying the chip area which roughened area penetrates the thermal paste and thermal adhesive and improves the adhesion and inhibits the flow of thermal paste from between the lower surface of the cooling plate and the upper surface of the chip during operation of the electronic module. A preferred cooling plate comprises a bead blasted roughened surface or plurality of criss-crossing channels forming protrusions having a width of less than about 1 mm and a channel width of about 1 mm to 5 mm.