The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 1998
Filed:
Feb. 14, 1997
Michael McAllister, Clintondale, NY (US);
Eric Daniel Perfecto, Poughkeepsie, NY (US);
James McDonald, Newburgh, NY (US);
Keshav Prasad, San Jose, CA (US);
Gordon J Robbins, Austin, TX (US);
Chandrika Prasad, Wappingers Falls, NY (US);
Madhavan Swaminathan, Marietta, GA (US);
George Eugene White, Marietta, GA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A multi-layer thin film structure having defined repair lines thereon and a method for repairing interconnections in the multi-layer thin film structure (MLTF) and/or making engineering charges (EC) are provided. The method comprises determining any interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, using lithography, e.g., direct write expose technology, to define the top surface connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization and repair lines using additive or substractive metallization techniques.