The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 1998

Filed:

Apr. 15, 1996
Applicant:
Inventors:

Ajay Jain, Austin, TX (US);

Kevin Lucas, Austin, TX (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F / ; H01L / ;
U.S. Cl.
CPC ...
430314 ; 430311 ; 430312 ; 430316 ; 430317 ; 438626 ; 438633 ; 438634 ; 438636 ; 438692 ; 438694 ; 438703 ; 438785 ; 216 18 ;
Abstract

The present invention provides an anti-reflective Ta.sub.3 N.sub.5 coating which can be used in a dual damascene structure and for I line or G line lithographies. In addition, the Ta.sub.3 N.sub.5 coating may also be used as an etch stop and a barrier layer. A dual damascene structure is formed by depositing a first dielectric layer (16). A dielectric tantalum nitride layer (18) is deposited on top of the first dielectric layer. A second dielectric layer (20) is deposited on the tantalum nitride layer. A dual damascene opening (34) is etched into the dielectric layers by patterning a first opening portion (26) and a second opening portion (32) using photolithography operations. Dielectric tantalum nitride layer (18) serves as an ARC layer during these operations to reduce the amount of reflectance from conductive region (14) to reduce distortion of the photoresist pattern. The use of a dielectric tantalum nitride layer as an ARC is particularly suitable for I line and G line lithography.


Find Patent Forward Citations

Loading…