The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 1998

Filed:

May. 30, 1996
Applicant:
Inventors:

Mitsuaki Iwashita, Nirasaki, JP;

Nobuo Konishi, Yamanashi-ken, JP;

Gerald A Krulik, San Clementa, CA (US);

Gary Cohrt, Gilbert, AZ (US);

Assignees:

Tokyo Electron Limited, Tokyo, JP;

IPEC-Planar, Phoenix, AZ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ; B24B / ;
U.S. Cl.
CPC ...
451-8 ; 451288 ;
Abstract

The invention relates to a method and an apparatus for polishing an object by CMP with use of a polishing liquid. A change point of the temperature of a surface-to-be-polished of the object at the time of polishing is detected on the basis of information on the temperature of the surface-to-be-polished of the object, which information is obtained in advance at the time of polishing. An end point of the polishing of the object is detected on the basis of information on the change point. The object and a reference object are interlocked and simultaneously polished by a common polishing body, the degree-of-polishing of the reference object is monitored, and the degree-of-polishing of the object is detected on the basis of the degree-of-polishing of the reference object.


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