The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 1997

Filed:

Aug. 22, 1995
Applicant:
Inventors:

Kiyokazu Ikeya, Shizuoka-ken, JP;

Kiyoshi Adachi, Hiratsuka, JP;

Masao Tohyama, Gotemba, JP;

Tomohiro Nakano, Gotemba, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
439268 ;
Abstract

A socket having a structure which is suitable for electrical connection with ball-shaped lead terminals of an IC package is shown. When a cover (12) is pushed down, a latch (70) moves away, a slide plate (40) slides toward the positive side in an X direction through levers (52) and (50) and movable shaft (58) and both arms of each contact maker (30) open. Each lead terminal (solder ball) (32a) of the BGA package (32) is freely inserted between both arms of a respective contact maker (30) when in the open state. When cover (12) rises to its highest position, slide plate (40) slides in the reverse direction by the spring force of a compression coil spring, thereby returning to the its original position and both arms of each contact (32) engage each lead terminal (32a) in such a way as to hold it from opposite sides with a result that an electrical connection based on compressive engagement is obtained between each contact element (30) and each respective terminal (32a).


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