The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 1997

Filed:

Dec. 21, 1995
Applicant:
Inventors:

Yoshihiko Yagi, Ashiya, JP;

Kazushi Higashi, Kadoma, JP;

Norihito Tsukahara, Kyoto, JP;

Koichi Kumagai, Ikoma, JP;

Takahiro Yonezawa, Neyagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437183 ; 437187 ; 437203 ; 437209 ;
Abstract

An electrode terminal (5) provided on a surface of a semiconductor chip (4) has a square shape in plane view. Further, the projecting apex portion (8a) of a bump (8) provided on the electrode terminal (5) orients to a corner portion (5a) of the electrode terminal (5). Hereupon, a gold ball (2a) formed by melting the lower end portion of a gold wire (2) supplied through a capillary (1) is joined to the electrode terminal (5), and then the capillary (1) is moved in the direction of a diagonal line of the square electrode (5). Thus, the main portion of the gold wire (2) is separated from the gold ball (2a) so that the bump (8) is formed.


Find Patent Forward Citations

Yagi, Yoshihiko. (1997). Semiconductor device and manufacturing method thereof (U.S. Patent No. 5686353). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5686353

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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